Solder joint reliability of indium-alloy interconnection
Identifieur interne : 000090 ( Main/Exploration ); précédent : 000089; suivant : 000091Solder joint reliability of indium-alloy interconnection
Auteurs : RBID : ISTEX:11664_1995_Article_BF02659725.pdfEnglish descriptors
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Abstract
Recent high-density very large scale integrated (VLSI) interconnections in multichip modules require high-reliability solder interconnection to enable us to achieve small interconnect size andlarge number of input/output terminals, and to minimize soft errors in VLSIs induced by α-particle emission from solder. Lead-free solders such as indium (In)-alloy solders are a possible alternative to conventional lead-tin (Pb-Sn) solders. To realize reliable interconnections using In-alloy solders, fatigue behavior, finite element method (FEM) simulations, and dissolution and reaction between solder and metallization were studied with flip-chip interconnection models. We measured the fatigue life of solder joints and the mechanical properties of solders, and compared the results with a computer simulation based on the FEM. Indium-alloy solders have better mechanical properties for solder joints, and their flip-chip interconnection models showed a longer fatigue life than that of Pb-Sn solder in thermal shock tests between liquid nitrogen and room temperatures. The fatigue characteristics obtained by experiment agree with that given by FEM analysis. Dissolution tests show that Pt film is resistant to dissolution into In solder, indicating that Pt is an adequate barrier layer material for In solder. This test also shows that Au dissolution into the In-Sn solder raises its melting point; however, Ag addition to In-Sn solder prevents melting point rise. Experimental results show that In-alloy solders are suitable for fabricating reliable interconnections.
DOI: 10.1007/BF02659725
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<record><TEI><teiHeader><fileDesc><titleStmt><title>Solder joint reliability of indium-alloy interconnection</title><author><name>Kozo Shimizu</name><affiliation wicri:level="1"><mods:affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</mods:affiliation><country xml:lang="fr">Japon</country><wicri:regionArea>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi</wicri:regionArea><wicri:noRegion>Atsugi</wicri:noRegion></affiliation></author><author><name>Teru Nakanishi</name><affiliation wicri:level="1"><mods:affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</mods:affiliation><country xml:lang="fr">Japon</country><wicri:regionArea>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi</wicri:regionArea><wicri:noRegion>Atsugi</wicri:noRegion></affiliation></author><author><name>Kazuaki Karasawa</name><affiliation wicri:level="1"><mods:affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</mods:affiliation><country xml:lang="fr">Japon</country><wicri:regionArea>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi</wicri:regionArea><wicri:noRegion>Atsugi</wicri:noRegion></affiliation></author><author><name>Kaoru Hashimoto</name><affiliation wicri:level="1"><mods:affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</mods:affiliation><country xml:lang="fr">Japon</country><wicri:regionArea>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi</wicri:regionArea><wicri:noRegion>Atsugi</wicri:noRegion></affiliation></author><author><name>Koichi Niwa</name><affiliation wicri:level="1"><mods:affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</mods:affiliation><country xml:lang="fr">Japon</country><wicri:regionArea>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi</wicri:regionArea><wicri:noRegion>Atsugi</wicri:noRegion></affiliation></author></titleStmt><publicationStmt><idno type="RBID">ISTEX:11664_1995_Article_BF02659725.pdf</idno><date when="1995">1995</date><idno type="doi">10.1007/BF02659725</idno><idno type="wicri:Area/Main/Corpus">000779</idno><idno type="wicri:Area/Main/Curation">000779</idno><idno type="wicri:Area/Main/Exploration">000090</idno></publicationStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Fatigue</term><term>Flip-chip</term><term>In alloys</term><term>Interconnection</term><term>Solder</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="eng">Recent high-density very large scale integrated (VLSI) interconnections in multichip modules require high-reliability solder interconnection to enable us to achieve small interconnect size andlarge number of input/output terminals, and to minimize soft errors in VLSIs induced by α-particle emission from solder. Lead-free solders such as indium (In)-alloy solders are a possible alternative to conventional lead-tin (Pb-Sn) solders. To realize reliable interconnections using In-alloy solders, fatigue behavior, finite element method (FEM) simulations, and dissolution and reaction between solder and metallization were studied with flip-chip interconnection models. We measured the fatigue life of solder joints and the mechanical properties of solders, and compared the results with a computer simulation based on the FEM. Indium-alloy solders have better mechanical properties for solder joints, and their flip-chip interconnection models showed a longer fatigue life than that of Pb-Sn solder in thermal shock tests between liquid nitrogen and room temperatures. The fatigue characteristics obtained by experiment agree with that given by FEM analysis. Dissolution tests show that Pt film is resistant to dissolution into In solder, indicating that Pt is an adequate barrier layer material for In solder. This test also shows that Au dissolution into the In-Sn solder raises its melting point; however, Ag addition to In-Sn solder prevents melting point rise. Experimental results show that In-alloy solders are suitable for fabricating reliable interconnections.</div></front></TEI><mods xsi:schemaLocation="http://www.loc.gov/mods/v3 file:///applis/istex/home/loadistex/home/etc/xsd/mods.xsd" version="3.4" istexId="869802e64700c97c85d336c25e9178e51b807bdc"><titleInfo lang="eng"><title>Solder joint reliability of indium-alloy interconnection</title></titleInfo><name type="personal"><namePart type="given">Kozo</namePart><namePart type="family">Shimizu</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</affiliation></name><name type="personal"><namePart type="given">Teru</namePart><namePart type="family">Nakanishi</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</affiliation></name><name type="personal"><namePart type="given">Kazuaki</namePart><namePart type="family">Karasawa</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</affiliation></name><name type="personal"><namePart type="given">Kaoru</namePart><namePart type="family">Hashimoto</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</affiliation></name><name type="personal"><namePart type="given">Koichi</namePart><namePart type="family">Niwa</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, 243-01, Atsugi, Japan</affiliation></name><typeOfResource>text</typeOfResource><genre>Original Paper</genre><originInfo><publisher>Springer-Verlag, New York</publisher><dateCreated encoding="w3cdtf">1994-03-25</dateCreated><dateValid encoding="w3cdtf">2007-06-23</dateValid><copyrightDate encoding="w3cdtf">1995</copyrightDate></originInfo><language><languageTerm type="code" authority="iso639-2b">eng</languageTerm></language><physicalDescription><internetMediaType>text/html</internetMediaType></physicalDescription><abstract lang="eng">Recent high-density very large scale integrated (VLSI) interconnections in multichip modules require high-reliability solder interconnection to enable us to achieve small interconnect size andlarge number of input/output terminals, and to minimize soft errors in VLSIs induced by α-particle emission from solder. Lead-free solders such as indium (In)-alloy solders are a possible alternative to conventional lead-tin (Pb-Sn) solders. To realize reliable interconnections using In-alloy solders, fatigue behavior, finite element method (FEM) simulations, and dissolution and reaction between solder and metallization were studied with flip-chip interconnection models. We measured the fatigue life of solder joints and the mechanical properties of solders, and compared the results with a computer simulation based on the FEM. Indium-alloy solders have better mechanical properties for solder joints, and their flip-chip interconnection models showed a longer fatigue life than that of Pb-Sn solder in thermal shock tests between liquid nitrogen and room temperatures. The fatigue characteristics obtained by experiment agree with that given by FEM analysis. Dissolution tests show that Pt film is resistant to dissolution into In solder, indicating that Pt is an adequate barrier layer material for In solder. This test also shows that Au dissolution into the In-Sn solder raises its melting point; however, Ag addition to In-Sn solder prevents melting point rise. Experimental results show that In-alloy solders are suitable for fabricating reliable interconnections.</abstract><subject lang="eng"><genre>Key words</genre><topic>Fatigue</topic><topic>flip-chip</topic><topic>In alloys</topic><topic>interconnection</topic><topic>solder</topic></subject><relatedItem type="series"><titleInfo type="abbreviated"><title>JEM</title></titleInfo><titleInfo><title>Journal of Electronic Materials</title><partNumber>Year: 1995</partNumber><partNumber>Volume: 24</partNumber><partNumber>Number: 1</partNumber></titleInfo><genre>Archive Journal</genre><originInfo><dateIssued encoding="w3cdtf">1995-01-01</dateIssued><copyrightDate encoding="w3cdtf">1995</copyrightDate></originInfo><subject usage="primary"><topic>Chemistry</topic><topic>Optical and Electronic Materials</topic><topic>Characterization and Evaluation of Materials</topic><topic>Solid State Physics and Spectroscopy</topic><topic>Electronics and Microelectronics, Instrumentation</topic></subject><identifier type="issn">0361-5235</identifier><identifier type="issn">Electronic: 1543-186X</identifier><identifier type="matrixNumber">11664</identifier><identifier type="local">IssueArticleCount: 11</identifier><recordInfo><recordOrigin>The Metallurgical of Society of AIME, 1995</recordOrigin></recordInfo></relatedItem><identifier type="doi">10.1007/BF02659725</identifier><identifier type="matrixNumber">Art8</identifier><identifier type="local">BF02659725</identifier><accessCondition type="use and reproduction">MetadataGrant: OpenAccess</accessCondition><accessCondition type="use and reproduction">AbstractGrant: OpenAccess</accessCondition><accessCondition type="restriction on access">BodyPDFGrant: Restricted</accessCondition><accessCondition type="restriction on access">BodyHTMLGrant: Restricted</accessCondition><accessCondition type="restriction on access">BibliographyGrant: Restricted</accessCondition><accessCondition type="restriction on access">ESMGrant: Restricted</accessCondition><part><extent unit="pages"><start>39</start><end>45</end></extent></part><recordInfo><recordOrigin>The Metallurgical of Society of AIME, 1995</recordOrigin><recordIdentifier>11664_1995_Article_BF02659725.pdf</recordIdentifier></recordInfo></mods></record>Pour manipuler ce document sous Unix (Dilib)
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